3 Reasons Why You Must Attend Hes International 2018
High-End Sensor technology markets are expanding and outpacing other sensor design categories
“Advanced sensors are an increasingly significant share of the global machine sensory market that is expected to exceed 30 billion devices by 2020 with revenue of (USD) $20 billion. The need for new HES technologies is outpacing other sensor design categories thanks to the ways these devices are proving themselves in the lab, the fab and for global manufacturers. Indeed, HES technologies are seen in more places now than ever before and are dropping in price while markets expand.” Mark Andrews, High-End Sensors International Conference Programme Manager
HES International will provide complete and comprehensive coverage of the entire value chain of the high-end sensors industry
Hear 25 presentations from industry leading players including Airbus, BAE Systems, Infineon Technologies, imec, Cadence Design Systems and Yole Développement among many others providing complete coverage of the HES industry across ten core HES topics.
These include: Machine Learning; Radar and LiDAR innovations; Defence/Security/Aviation/Aerospace sensors; Advances in MEMS Sensors Development, Metrology and testing; Imaging and Optical Sensing Advances; Optimising IoT & IIOT sensor networks and security as well as exploring emerging opportunities and applications for HES technologies.
Exceptional global networking opportunities – 250 companies. 24 countries.
Co-located with Compound Semiconductor International and Photonic Integrated Circuits International Conferences, there will be many companies to network with at the exhibition, representing the global high-end sensors, compound semiconductor and integrated photonics industries.
Countries represented at the 3 co-located events include:
AUSTRIA, BELGIUM, CANADA, CHINA, FINLAND, FRANCE, GERMANY, IRELAND, INDIA, ISRAEL, ITALY, NETHERLANDS, NORWAY, POLAND, SPAIN, SWITZERLAND, UNITED KINGDOM, UNITED ARAB EMIRATES, UNITED STATES, LITHUANIA, JAPAN, RUSSIA, SWEDEN, TURKEY.
Companies attending the 3 co-located events include:
III-V Reclaim, Aarhus University, Adenso Gmbh, Advanced Fibreoptic Engineering, Advantest Europe Gmbh, Airbus, AIXTRON, Almae Technologies, AMS AG, Analog Devices, Antwerp Space, Applied Materials, Aryballe Technologies, Asm, Asml, Attolight, Axt, Azelis, Azur Space Solar Power GmbH, BAE Systems, Bay Photonics Ltd, Beneq, Broadcom, Brolis Semiconductors, Bruker, Cadence Design Systems, Cardiff University, CEA-Leti, CEMAC, Changelight, Chroma Ate Inc, Cisco, Cleveland Bridge, College of Optics & Photonics, University Central Florida, Colorchip, Compound Semiconductor Centre, Comptek Solutions, Cordon Electronics Italia, CORNERSTONE, CS Catapult, CS CLEAN SOLUTIONS AG, CSIR, Kolkata, CST Global, DELO Industrie Klebstoffe GmbH & Co. KGaA, Dialog Semiconductor GmbH, Disco Hi Tec Europe Gmbh, Dockweiler Chemicals Gmbh, Dow, Dow Silicones, DR YIELD, Dz Raypro Sensing, Dzrb Sensing, EAG Laboratories, Eblana Photonics, Effect Photonics, Egide, Eindhoven University Of Technology, Electron-mec, EM Microelectronic – Marin, SA, Entreprise Saker, EPC, EPIC – European Photonics Industry Consortium, EpiGaN, Eumetrys, European Commission, European Defence Agency, EV Group, Evatec, EXAGAN, Facebook, Faculty Of Physics Warsaw University Of Technology, Ferrotec, Fhr Anlagenbau GmbH, FHR Centrotherm Group, Fibos, Fibre Systems, ficonTEC Service GmbH, Finisar, First Sensor, Fraunhofer ENAS, Fraunhofer HHI, Fraunhofer Iisb, Fraunhofer IOSB, Freedom Photonics, Ghent University/Imec, GTI Technologies Inc, Hewlett Packard Enterprise, HTT High Tech Trade GmbH, Huawei, IBM, Ihp, IHS Markit, II-Vi Gmbh, Ilika Technologies, Imec, imec/Ghent University, IMS Chips, Indium Corporation, Infineon, Inha University, Inphi, Inspectrology Llc, Institute For Crystal Growth, Institute of Microelectronics, Singapore, Intego Gmbh, Intel, Intengent Inc, International Frequency Sensor Association, IQE, IST-AG, Istanbul Sehir University, JePPIX/PITC, JSC RESEARCH & PRODUCTION CORPORATION, JTA Equipment Technology, Kaiam Corporation, Karlsruher Institut fuer Technologie (KIT), Kemet Electronics, Keysight Technologies, KLA-Tencor, KnowMade, KU Leuven, Kubos Semiconductors Ltd, Laser & Engineering Technologies Cluster LITEK, LayTec, LIGENTEC, Light Tec GmbH, Lightwave Logic, LioniX International, Lockheed Martin, Luceda Photonics, Lumerical Inc, Lund University, Macom Technology Solutions, Maescap As, Mapper Lithography BV, Materion, Mei Llc, Mei Wet Processing Systems And Services Llc, Melexis, Memscap As, Mentor Graphics, Merconics, Mersen, Micro Electronic Gmbh, MicroCircuit Laboratories LLC, MIRPHAB/CEA-Leti, MIRPHAB/PIXAPP, Multiphoton Optics GmbH, N2Scientific, Nanometrics, Nanoscribe GmbH, Nanotechnology Research Center, Nanotronics, Nanowin, NAsP III/V GmbH, NEC Corporation, Nextnano GmbH, Nokia Bell Labs, NTT Photonics, Okmetic, OMMIC, On Semiconductor Belgium, Optoelectronics Research Centre, University of Southampton, Osram Licht Ag, Osram Opto Semiconductors, OSTEC Enterprise Ltd, Ostendo Technologies, Oxford Instruments Plasma Technology, Panasonic Corporation, Partner Arch Ventures Partners Europe, Pegasus Chemicals Limited, Physik Instrumente, Picosun Oy, Pilz GmbH & Co. KG, PInS, Plansee Se, Plasma-Therm, Plessey Technologies, Plextek-RFI, Ppm Pure Metals Gmbh, Qorvo, Qromis, Quside, Revasum, RFHIC, Riber, Robert Bosch Gmbh, Rostov Research Institute Of Radio Communication, RWTH Aachen University, Saint Gobain Lumilog, SAMCO, SEMI Europe, Seoul Semiconductor, Seren Photonics Ltd, Sigma Designs, Silicon Photonics Product Division, Intel, Siltronic AG, Sino Nitride Semiconductor, SMART Photonics B.V., Soitec, Sony, ST Microelectronics, Stifel, Strategy Analytics, Sumco Europe Sales Plc, Suss Microoptics, Synopsys, Inc., System Plus Consulting, Technobis Group, Teem Photonics, Teledyne Dalsa Gmbh, Temescal, Thrombosis UK, Tiger Optics, Transphorm, Tsinghua University, Tu, Tyndall National Institute, Umicore, Universitat Polit De Val, Universities Of Cardiff And Cambridge, University of Bristol, University of Glasgow, University Of Manchester, University of Southampton, Utc Aerospace, Veeco, VEM, VIDaP Consortium, Visic Technologies, Vistec Electron Beam GmbH, VLC Photonics, VPIphotonics, VTEC, Waldytech, Win Cayman, Win Semiconductors Corp, Yole Développement.
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If you have not already booked your place, there are less than 50 places left, so book today